Our company's main products are ceramic substrate circuit boards, such as alumina ceramic substrate, aluminum nitride ceramicnitride substrate, zirconia ceramic substrate, glass, quartz and so on, using Laser Activation Metallization Technology(LAM).
Between the metal layer and the ceramic with high strength, good electrical properties, can be repeated welding, metal layer thickness can be adjusted within 1m-1mm, L/S resolution can reach 20m, can be directly realized through holes to connect, to provide customized production service for customers.
Our products have a number of patents in the development and production process, technology has completely independent intellectual property rights, the current annual production capacity of 18000 square meters.
Our company have a professional production, R & D team, advanced marketing management system and the quality of soft, hardware facilities. The systematic decision-making process and strict warehouse management system, to provide protection for the efficiency of our production. We are committed to providing the most professional, most quickly to customers around the world, the most intimate of customized services.